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Themal Shock Test Chamber

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公司名稱廣東宏展科技有限公司
品牌
型號HTSD-100
所在地蘇州市
廠商性質(zhì)生產(chǎn)廠家
更新時間2017/12/10 9:33:18
訪問次數(shù)1184

產(chǎn)品標(biāo)簽:

Themal Shock Test Chamber

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展開顯示更多內(nèi)容

可程式恒溫恒濕試驗(yàn)箱/高低溫試驗(yàn)箱/高低溫交變濕熱試驗(yàn)箱/紫外老化試驗(yàn)機(jī)/步入式恒溫恒濕實(shí)驗(yàn)室/冷熱沖擊試驗(yàn)箱/快速溫變試驗(yàn)箱

產(chǎn)品簡介在線詢價

The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing

Themal Shock Test Chamber 產(chǎn)品信息

Themal Shock Test Chamber HTSD-100

About

Uniform thermal stress performances

The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing.
Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the research and development, inspection or production field.

Meeting International Standards

The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.

Reduced power consumption

Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%.

Specifications

Model	Temperature range	Inside / Outside dimensions （mm）
TSD-100	High temp. exposure: +60 to +200°C [+140 to +392°F] Low temp. exposure: -65 to 0°C [-85 to +32°F]	W710xH345xD410 / W1100xH1885xD1965

Features

Short temperature recovery time
The two temperature zone system achieves quick specimen temperature recovery time （less than 15 min. for 10kg of ICs, at extreme temperature exposure）.
Excellent temperature uniformity
ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results.
STT function （Specimen Temperature Trigger）
The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy.
Ambient temperature recovery feature
Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely.

Specimen temperature recovery （example）
（based on MIL-883 condition C）

Test conditions
High temp. exposure: +155°C for 30 min.
Low temp. exposure: -68°C for 30 min.
Specimens: ICs, 10 kg

Temperature uniformity measurement method
Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. （Specimens with embedded thermocouples were placed beneath other ICs.）

Temperature uniformity performance （example）

Test conditions
High temp. exposure: +150°C for 30 min.
Low temp. exposure: -65°C for 30 min.
Specimens: ICs （×10）

Temperature uniformity measurement method
Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket.

Test time comparison （example）

Test conditions
High temp. exposure: +150°C, 15 min. after recovery
Low temp. exposure: -65°C, 15 min. after recovery
Specimens: ICs, 10kg
Control points: Upstream of sensor positions

Measurements
Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month.

Tset Standards

Compatible test standards

IEC 60749-25 : Semiconductor devices – Temperature cycling
IEC 60068-2-14 Na : Environmental testing – Change of temperature
IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods
MIL-STD-202G : Test method standard – Electronic and electrical component parts
MIL-STD-883F : Military standard, microcircuits, test standards
IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board
SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications
JASO-D001 : General rules of environmental testing methods for automotive electronic equipment
JASO-D902 : Durability testing methods for automotive electronic equipment
EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. （General）
EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices
EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition

Options

Paperless recorder
Temperature recorder （digital）
Recorder terminal
STT 3-point Expansion
Specimen temperature measuring thermocouple
Total cycle counter
Additional cable port
Cable port rubber plug
Specimen basket/ shelf bracket
Chamber dew tray
External alarm terminal
Fixture for securing body
Communication cables
Viewing window
Exposure signal output

Temperature recorder for future installation
Heavy-duty shelves
Casters
Additional overheat protector
Emergency stop switch
Communication functions
Power cord
Additional overheat protector
Auxiliary cooling injector （LN₂ or LCO₂）

Themal Shock Test Chamber HTSD-100

About

Uniform thermal stress performances

Meeting International Standards

The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.

Reduced power consumption

Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%.

Specifications

Model	Temperature range	Inside / Outside dimensions （mm）
TSD-100	High temp. exposure: +60 to +200°C [+140 to +392°F] Low temp. exposure: -65 to 0°C [-85 to +32°F]	W710xH345xD410 / W1100xH1885xD1965

Features

Short temperature recovery time
The two temperature zone system achieves quick specimen temperature recovery time （less than 15 min. for 10kg of ICs, at extreme temperature exposure）.
Excellent temperature uniformity
ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results.
STT function （Specimen Temperature Trigger）
The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy.
Ambient temperature recovery feature
Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely.

Specimen temperature recovery （example）
（based on MIL-883 condition C）

Test conditions
High temp. exposure: +155°C for 30 min.
Low temp. exposure: -68°C for 30 min.
Specimens: ICs, 10 kg

Temperature uniformity performance （example）

Test conditions
High temp. exposure: +150°C for 30 min.
Low temp. exposure: -65°C for 30 min.
Specimens: ICs （×10）

Temperature uniformity measurement method
Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket.

Test time comparison （example）

Test conditions
High temp. exposure: +150°C, 15 min. after recovery
Low temp. exposure: -65°C, 15 min. after recovery
Specimens: ICs, 10kg
Control points: Upstream of sensor positions

Measurements
Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month.

Tset Standards

Compatible test standards

Options

Paperless recorder
Temperature recorder （digital）
Recorder terminal
STT 3-point Expansion
Specimen temperature measuring thermocouple
Total cycle counter
Additional cable port
Cable port rubber plug
Specimen basket/ shelf bracket
Chamber dew tray
External alarm terminal
Fixture for securing body
Communication cables
Viewing window
Exposure signal output

Temperature recorder for future installation
Heavy-duty shelves
Casters
Additional overheat protector
Emergency stop switch
Communication functions
Power cord
Additional overheat protector
Auxiliary cooling injector （LN₂ or LCO₂）

HTSD-100

About

Uniform thermal stress performances

Meeting International Standards

The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.

Reduced power consumption

Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%.

Specifications

Model	Temperature range	Inside / Outside dimensions （mm）
TSD-100	High temp. exposure: +60 to +200°C [+140 to +392°F] Low temp. exposure: -65 to 0°C [-85 to +32°F]	W710xH345xD410 / W1100xH1885xD1965

Features

Short temperature recovery time
The two temperature zone system achieves quick specimen temperature recovery time （less than 15 min. for 10kg of ICs, at extreme temperature exposure）.
Excellent temperature uniformity
ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results.
STT function （Specimen Temperature Trigger）
The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy.
Ambient temperature recovery feature
Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely.

Specimen temperature recovery （example）
（based on MIL-883 condition C）

Test conditions
High temp. exposure: +155°C for 30 min.
Low temp. exposure: -68°C for 30 min.
Specimens: ICs, 10 kg

Temperature uniformity performance （example）

Test conditions
High temp. exposure: +150°C for 30 min.
Low temp. exposure: -65°C for 30 min.
Specimens: ICs （×10）

Temperature uniformity measurement method
Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket.

Test time comparison （example）

Test conditions
High temp. exposure: +150°C, 15 min. after recovery
Low temp. exposure: -65°C, 15 min. after recovery
Specimens: ICs, 10kg
Control points: Upstream of sensor positions

Measurements
Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month.

Tset Standards

Compatible test standards