| Accurate testing for electronics industry The “liquid to liquid” thermal shock testing draw more and more attention for its ability to impose higher stress on specimens than the classic “air to air” thermal shock tests, but also for delivering quicker test results.
HONGZHAN developed next-generation equipment satisfying environment conservation by lowering running costs, especially regarding brine and power consumption. |
Specifications | Model | Temperature range | Basket dimensions / Outside dimensions （mm） | | HTSB-21 | Hot bath: +70 to +200°C （+158 to +392°F）
Cold bath: -65 to 0°C （-85 to +32°F） | W120×H150×D120 / W1140×H1785×D1240 | | HTSB-51 | W150×H150×D200 / W1200×H1785×D1320 | | Features - Drastic reduction in brine consumption
Brine consumption reduced by 65% compared to previous model, thanks to test area air tightness, （no vapor leakage, no brine evaporation） and water separation filter （brine recycling）. - Meeting International Standards
HTSB chamber achieves testing in accordance to standards requirements for immersion test: MIL, JIS and IEC. - Energy-saving
HONGZHAN’s original refrigeration system allows saving up to 52% in power consumption, assisting customers in environment conservation policy. | - Brine Consumption
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